Sony’s Next-Gen Camera Sensor Could Allow Apple To Make Thinner iPhones

Sony, which designs camera modules used by Apple in iPhone 4S has announced the next generation smaller CMOS image sensor, which could allow for even sleeker iPhone models in the coming years. The all new CMOS (complementary metal-oxide semiconductor) sensor introduced by Sony is backside illuminated module, which enables better photo quality in more small size. The CMOS layers pixel section comprising of backside illuminated structure pixels onto chips consisting circuit section for signal processing. Advantages of this sensor include large scale signal processing circuits needed for better functionality and higher image quality are built in; higher image quality of pixel section by adopting manufacturing processes specialized for better image quality, lower power consumption and faster speeds by adopting lead processes for circuit section and small image sensor chip size.

Besides, the entrance of Sony in iPhone camera supply chain was long-established by Chipworks and iFixit, who disassembles iPhone 4S and did X-ray cross-section of eight-megapixel camera found on iPhone 4S.

Thank You : techsoft.org